IRFB7440PBF

N-channel Power MOSFET featuring 40V drain-source voltage and 172A continuous drain current. This single-element HEXFET technology MOSFET is housed in a TO-220AB package with 3 through-hole pins and a tab. It offers a low drain-source on-resistance of 2.5 mΩ at 10V and a maximum power dissipation of 143W, operating across a wide temperature range of -55°C to 175°C.

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About IRFB7440PBF

The Infineon IRFB7440PBF Semiconductors datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: N-channel Power MOSFET featuring 40V drain-source voltage and 172A continuous drain current. This single-element HEXFET technology MOSFET is housed in a TO-220AB package with 3 through-hole pins and a tab. It offers a low drain-source on-resistance of 2.5 mΩ at 10V and a maximum power dissipation of 143W, operating across a wide temperature range of -55°C to 175°C.. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Through Hole, Cage Code: CG091, and Category: Power MOSFET. IRFB7440PBF is manufactured by Infineon as part of their Semiconductors product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer
Infineon
Category
Semiconductors
File Size
249 KB

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Parameters

AEC QualifiedNo
AutomotiveNo
Basic Package TypeThrough Hole
Cage CodeCG091
CategoryPower MOSFET
Channel ModeEnhancement
Channel TypeN
ConfigurationSingle
ECCNEAR99
EU RoHSYes
HTS Code8541290095
JedecTO-220AB
Lead ShapeThrough Hole
Maximum Continuous Drain Current172A
Maximum Drain Source Resistance2.5@10VmOhm
Maximum Drain Source Voltage40V
Maximum Gate Source Voltage±20V
Maximum Gate Threshold Voltage3.9V
Maximum Power Dissipation143000mW
Max Operating Temperature175°C
Min Operating Temperature-55°C
MountingThrough Hole
Number of Elements per Chip1
Package/CaseTO-220AB
Package DescriptionTransistor Outline Package
Package Family NameTO-220
Package Height (mm)9.02(Max)
Package Length (mm)10.67(Max)
Package MaterialPlastic
Package Width (mm)4.83(Max)
PCB3
Pin Count3
Pin Pitch (mm)2.54
PPAPNo
Process TechnologyHEXFET
RoHS Versions2011/65/EU, 2015/863
Schedule B8541290080
Seated Plane Height (mm)20.57(Max)
TabTab
Typical Gate Charge @ 10V90nC
Typical Gate Charge @ Vgs90@10VnC
Typical Input Capacitance @ Vds4730@25VpF