Espressif Systems
ESP32-C3
Low-power Wi-Fi and Bluetooth Low Energy microcontroller SoC integrates a 32-bit single-core RISC-V processor running up to 160 MHz. The device supports 2.4 GHz IEEE 802.11b/g/n Wi-Fi with 20 MHz and 40 MHz bandwidth and Bluetooth 5 LE data rates from 125 Kbps to 2 Mbps. On-chip resources include 400 KB SRAM, 384 KB ROM, 8 KB RTC SRAM, 4096-bit eFuse memory, security accelerators, and 22 configurable GPIOs. The base chip is supplied in a 32-pin 5 mm by 5 mm QFN package and operates from 3.0 V to 3.6 V over a -40 °C to 105 °C ambient range.
ESP32-C3-FH4
Low-power Wi-Fi and Bluetooth Low Energy microcontroller SoC integrates a 32-bit single-core RISC-V processor running up to 160 MHz. The device supports 2.4 GHz IEEE 802.11b/g/n Wi-Fi with 20 MHz and 40 MHz bandwidth and Bluetooth 5 LE data rates from 125 Kbps to 2 Mbps. On-chip resources include 400 KB SRAM, 384 KB ROM, 8 KB RTC SRAM, 4096-bit eFuse memory, security accelerators, and 22 configurable GPIOs. The base chip is supplied in a 32-pin 5 mm by 5 mm QFN package and operates from 3.0 V to 3.6 V over a -40 °C to 105 °C ambient range.
ESP32-C3-Mini-1
General-purpose 2.4 GHz Wi-Fi and Bluetooth LE MCU module integrates a single-core 32-bit RISC-V processor running up to 160 MHz. The module includes an on-board PCB antenna, up to 15 GPIOs, and common peripherals including SPI, UART, I2C, I2S, LED PWM, TWAI, USB serial/JTAG, ADC, timers, and a temperature sensor. It operates from a 3.0 V to 3.6 V supply and is available in ambient-temperature variants rated for -40 °C to 85 °C or -40 °C to 105 °C. The module measures 13.2 mm by 16.6 mm by 2.4 mm and carries RoHS and REACH green certification.
ESP32-C6-WROOM-1
Wireless MCU module supports 2.4 GHz Wi-Fi 6, Bluetooth LE, Zigbee 3.0 and Thread connectivity. The module is built around a single-core 32-bit RISC-V microprocessor running up to 160 MHz and includes 4 MB Quad SPI flash. It uses an on-board PCB antenna and exposes 23 GPIOs with interfaces including SPI, UART, I2C, I2S, USB Serial/JTAG, ADC and PWM. Operation is specified from 3.0 V to 3.6 V and from -40 °C to 85 °C ambient temperature. The module is rated MSL 3 and has RoHS and REACH green certification.
ESP32-H2
Low-power wireless SoC integrates a 32-bit RISC-V single-core processor with Bluetooth Low Energy and IEEE 802.15.4 radios. The device supports Thread, Zigbee 3.0, Matter, Bluetooth mesh, and Bluetooth LE long range operation. It includes 128 KB ROM, 320 KB SRAM, 4 KB low-power memory, 16 KB cache, and 2 MB or 4 MB in-package Quad SPI flash. The QFN32 package operates from a 3.0 V to 3.6 V supply over a -40 °C to 105 °C ambient temperature range. Peripheral resources include 19 programmable GPIOs, SPI, UART, I2C, I2S, USB Serial/JTAG, ADC, PWM, RMT, TWAI, and security accelerators.
ESP32-H2-WROOM-1-N4
Low-power wireless SoC integrates a 32-bit RISC-V single-core processor with Bluetooth Low Energy and IEEE 802.15.4 radios. The device supports Thread, Zigbee 3.0, Matter, Bluetooth mesh, and Bluetooth LE long range operation. It includes 128 KB ROM, 320 KB SRAM, 4 KB low-power memory, 16 KB cache, and 2 MB or 4 MB in-package Quad SPI flash. The QFN32 package operates from a 3.0 V to 3.6 V supply over a -40 °C to 105 °C ambient temperature range. Peripheral resources include 19 programmable GPIOs, SPI, UART, I2C, I2S, USB Serial/JTAG, ADC, PWM, RMT, TWAI, and security accelerators.
ESP32-S2
The 2.4 GHz Wi-Fi MCU module integrates an ESP32-S2 single-core Xtensa 32-bit LX7 processor operating up to 240 MHz. It includes 4 MB SPI flash, 2 MB PSRAM, 37 GPIOs, and an on-board PCB antenna. The module supports IEEE 802.11b/g/n operation from 2412 to 2484 MHz with data rates up to 150 Mbps. It operates from a 3.0 to 3.6 V supply across -40 to 85 °C and is RoHS/REACH green certified. The module measures 18.0 × 31.0 × 3.3 mm and is marked End of Life.
ESP32-S2-WROOM
2.4 GHz Wi-Fi MCU module integrates an ESP32-S2 single-core Xtensa LX7 microprocessor running up to 240 MHz. It supports IEEE 802.11 b/g/n operation from 2412 to 2484 MHz with a data rate up to 150 Mbps. The module includes 4 MB SPI flash, 37 GPIOs, a PCB antenna, and a 40 MHz crystal oscillator. It operates from a 3.0 to 3.6 V supply over a -40 to 85 °C ambient temperature range and measures 18.0 × 31.0 × 3.3 mm. RoHS and REACH green certifications are specified.
ESP32-S2-WROVER
2.4 GHz Wi-Fi MCU Module with 4 MB Flash
ESP32-S3
Dual-core microcontroller SoC integrates 2.4 GHz Wi-Fi 4 and Bluetooth LE 5 connectivity for AIoT applications. The device uses an Xtensa LX7 32-bit dual-core CPU running up to 240 MHz with 512 KB SRAM and 384 KB ROM. It provides up to 45 programmable GPIOs plus I2C, I2S, SPI, UART, USB OTG, ADC, touch, SD/MMC host and TWAI interfaces. The QFN56 package operates from 3.0 V to 3.6 V and supports an extended temperature range up to 105 °C for the base ESP32-S3 variant.
ESP32-S3-DevKitC-1
Dual-core microcontroller SoC integrates 2.4 GHz Wi-Fi 4 and Bluetooth LE 5 connectivity for AIoT applications. The device uses an Xtensa LX7 32-bit dual-core CPU running up to 240 MHz with 512 KB SRAM and 384 KB ROM. It provides up to 45 programmable GPIOs plus I2C, I2S, SPI, UART, USB OTG, ADC, touch, SD/MMC host and TWAI interfaces. The QFN56 package operates from 3.0 V to 3.6 V and supports an extended temperature range up to 105 °C for the base ESP32-S3 variant.
ESP32-S3-WROOM-1
Wi-Fi and Bluetooth LE MCU module integrates an ESP32-S3 series dual-core Xtensa LX7 processor running up to 240 MHz. The module provides 8 MB Quad SPI flash, 8 MB Octal SPI PSRAM, 384 KB ROM, 512 KB SRAM, and 16 KB RTC SRAM. Wireless connectivity includes 2.4 GHz 802.11b/g/n Wi-Fi up to 150 Mbps and Bluetooth 5 LE with 125 Kbps to 2 Mbps PHY rates. The PCB-antenna module operates from a 3.0 V to 3.6 V supply over a -40 °C to 65 °C ambient range and measures 18.0 mm by 25.5 mm by 3.1 mm.
ESP32-S3-WROOM-1-N8R8
Wi-Fi and Bluetooth LE MCU module integrates an ESP32-S3 series dual-core Xtensa LX7 processor running up to 240 MHz. The module provides 8 MB Quad SPI flash, 8 MB Octal SPI PSRAM, 384 KB ROM, 512 KB SRAM, and 16 KB RTC SRAM. Wireless connectivity includes 2.4 GHz 802.11b/g/n Wi-Fi up to 150 Mbps and Bluetooth 5 LE with 125 Kbps to 2 Mbps PHY rates. The PCB-antenna module operates from a 3.0 V to 3.6 V supply over a -40 °C to 65 °C ambient range and measures 18.0 mm by 25.5 mm by 3.1 mm.
ESP32-WROOM-32E
The 2.4 GHz Wi-Fi and Bluetooth LE MCU module integrates an Xtensa dual-core 32-bit LX6 microprocessor running up to 240 MHz. It supports IEEE 802.11b/g/n, Bluetooth v4.2 BR/EDR, and Bluetooth LE with 2412 MHz to 2484 MHz operation. The module provides up to 26 GPIOs, rich digital and analog peripherals, a 40 MHz crystal oscillator, Quad SPI flash options from 4 MB to 16 MB, and optional 2 MB PSRAM on supported variants. It operates from a 3.0 V to 3.6 V supply across -40 °C to 85 °C or -40 °C to 105 °C versions and uses an on-board PCB antenna. The module measures 18.0 mm by 25.5 mm by 3.1 mm and is REACH/RoHS green certified.
ESP32-WROOM-32U
Wireless module integrates an ESP32 dual-core 32-bit LX6 microprocessor for 2.4 GHz Wi-Fi, Bluetooth BR/EDR, and Bluetooth LE connectivity. The module supports up to 240 MHz CPU operation, up to 26 GPIOs, and common embedded interfaces including UART, SPI, SDIO, I2C, I2S, ADC, DAC, PWM, and TWAI. External antenna connection is provided through a compatible U.FL, MHF I, or AMC connector. Supply operation is specified from 3.0 V to 3.6 V, with operating ambient temperature options from -40 °C to 85 °C or -40 °C to 105 °C depending on suffix. Green certification includes REACH and RoHS compliance.
ESP32-WROOM-32UE
Wireless module integrates an ESP32 dual-core 32-bit LX6 microprocessor for 2.4 GHz Wi-Fi, Bluetooth BR/EDR, and Bluetooth LE connectivity. The module supports up to 240 MHz CPU operation, up to 26 GPIOs, and common embedded interfaces including UART, SPI, SDIO, I2C, I2S, ADC, DAC, PWM, and TWAI. External antenna connection is provided through a compatible U.FL, MHF I, or AMC connector. Supply operation is specified from 3.0 V to 3.6 V, with operating ambient temperature options from -40 °C to 85 °C or -40 °C to 105 °C depending on suffix. Green certification includes REACH and RoHS compliance.
ESP8266
Wi-Fi MCU SoC integrates a 32-bit Tensilica L106 RISC processor with 2.4 GHz IEEE 802.11b/g/n connectivity. The device supports HT20 Wi-Fi data rates up to 75 Mbps and operates from a 2.5 V to 3.6 V supply. It provides 160 KB SRAM, 17 GPIOs, standard digital peripheral interfaces, and on-chip RF and power-management functions. The QFN32 package measures 5 mm by 5 mm and supports industrial operating temperatures from -40 °C to 125 °C.
ESP8266EX
Highly integrated Wi-Fi 4 SoC provides 802.11 b/g/n connectivity in the 2.4 GHz band with station, SoftAP, and combined station plus SoftAP modes. The device integrates a Tensilica L106 32-bit processor running up to 160 MHz, on-chip SRAM, RF front end functions, power management, and interfaces including UART, SDIO, SPI, I2C, I2S, GPIO, PWM, IR, and ADC. It operates from 2.5 V to 3.6 V across a -40 °C to 125 °C temperature range and is supplied in a 32-pin 5 mm x 5 mm QFN package. The lifecycle status is not recommended for new designs.