ESP8266
Wi-Fi MCU SoC integrates a 32-bit Tensilica L106 RISC processor with 2.4 GHz IEEE 802.11b/g/n connectivity. The device supports HT20 Wi-Fi data rates up to 75 Mbps and operates from a 2.5 V to 3.6 V supply. It provides 160 KB SRAM, 17 GPIOs, standard digital peripheral interfaces, and on-chip RF and power-management functions. The QFN32 package measures 5 mm by 5 mm and supports industrial operating temperatures from -40 °C to 125 °C.
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About ESP8266
The Espressif Systems ESP8266 Computing Embedded Systems datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: Wi-Fi MCU SoC integrates a 32-bit Tensilica L106 RISC processor with 2.4 GHz IEEE 802.11b/g/n connectivity. The device supports HT20 Wi-Fi data rates up to 75 Mbps and operates from a 2.5 V to 3.6 V supply. It provides 160 KB SRAM, 17 GPIOs, standard digital peripheral interfaces, and on-chip RF and power-management functions. The QFN32 package measures 5 mm by 5 mm and supports industrial operating temperatures from -40 °C to 125 °C.. Key parameters include Bluetooth: N/A, Embedded flash: 0, GPIO count: 17, Maximum CPU frequency: 160, and Operating temperature: -40 to 125. ESP8266 is manufactured by Espressif Systems as part of their Computing Embedded Systems product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Espressif Systems
- Category
- Computing Embedded Systems
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Parameters
| Bluetooth | N/A |
| Embedded flash | 0 |
| GPIO count | 17 |
| Maximum CPU frequency | 160 |
| Operating temperature | -40 to 125 |
| Package | QFN32 |
| Package size | 5 x 5 |
| Pin count | 32 |
| Processor core | Tensilica L106 32-bit RISC |
| Product type | SoC |
| PSRAM | 0 |
| SRAM | 160 |
| Supply voltage | 2.5 to 3.6 |
| Wi-Fi band | 2.4 |
| Wi-Fi channel width | HT20 |
| Wi-Fi data rate | Up to 75 |
| Wi-Fi standard | IEEE 802.11b/g/n |