ESP32-S3-DevKitC-1

Dual-core microcontroller SoC integrates 2.4 GHz Wi-Fi 4 and Bluetooth LE 5 connectivity for AIoT applications. The device uses an Xtensa LX7 32-bit dual-core CPU running up to 240 MHz with 512 KB SRAM and 384 KB ROM. It provides up to 45 programmable GPIOs plus I2C, I2S, SPI, UART, USB OTG, ADC, touch, SD/MMC host and TWAI interfaces. The QFN56 package operates from 3.0 V to 3.6 V and supports an extended temperature range up to 105 °C for the base ESP32-S3 variant.

Download PDF

Similar Components

ESP8266

Wi-Fi MCU SoC integrates a 32-bit Tensilica L106 RISC processor with 2.4 GHz IEEE 802.11b/g/n connectivity. The device supports HT20 Wi-Fi data rates up to 75 Mbps and operates from a 2.5 V to 3.6 V supply. It provides 160 KB SRAM, 17 GPIOs, standard digital peripheral interfaces, and on-chip RF and power-management functions. The QFN32 package measures 5 mm by 5 mm and supports industrial operating temperatures from -40 °C to 125 °C.

Espressif SystemsComputing Embedded Systems
28 4

ESP32-S3

Dual-core microcontroller SoC integrates 2.4 GHz Wi-Fi 4 and Bluetooth LE 5 connectivity for AIoT applications. The device uses an Xtensa LX7 32-bit dual-core CPU running up to 240 MHz with 512 KB SRAM and 384 KB ROM. It provides up to 45 programmable GPIOs plus I2C, I2S, SPI, UART, USB OTG, ADC, touch, SD/MMC host and TWAI interfaces. The QFN56 package operates from 3.0 V to 3.6 V and supports an extended temperature range up to 105 °C for the base ESP32-S3 variant.

Espressif SystemsComputing Embedded Systems
29 9

ESP8266EX

Highly integrated Wi-Fi 4 SoC provides 802.11 b/g/n connectivity in the 2.4 GHz band with station, SoftAP, and combined station plus SoftAP modes. The device integrates a Tensilica L106 32-bit processor running up to 160 MHz, on-chip SRAM, RF front end functions, power management, and interfaces including UART, SDIO, SPI, I2C, I2S, GPIO, PWM, IR, and ADC. It operates from 2.5 V to 3.6 V across a -40 °C to 125 °C temperature range and is supplied in a 32-pin 5 mm x 5 mm QFN package. The lifecycle status is not recommended for new designs.

Espressif SystemsComputing Embedded Systems
27 4

ESP32-S2

The 2.4 GHz Wi-Fi MCU module integrates an ESP32-S2 single-core Xtensa 32-bit LX7 processor operating up to 240 MHz. It includes 4 MB SPI flash, 2 MB PSRAM, 37 GPIOs, and an on-board PCB antenna. The module supports IEEE 802.11b/g/n operation from 2412 to 2484 MHz with data rates up to 150 Mbps. It operates from a 3.0 to 3.6 V supply across -40 to 85 °C and is RoHS/REACH green certified. The module measures 18.0 × 31.0 × 3.3 mm and is marked End of Life.

Espressif SystemsComputing Embedded Systems
26 7

ESP32-C3

Low-power Wi-Fi and Bluetooth Low Energy microcontroller SoC integrates a 32-bit single-core RISC-V processor running up to 160 MHz. The device supports 2.4 GHz IEEE 802.11b/g/n Wi-Fi with 20 MHz and 40 MHz bandwidth and Bluetooth 5 LE data rates from 125 Kbps to 2 Mbps. On-chip resources include 400 KB SRAM, 384 KB ROM, 8 KB RTC SRAM, 4096-bit eFuse memory, security accelerators, and 22 configurable GPIOs. The base chip is supplied in a 32-pin 5 mm by 5 mm QFN package and operates from 3.0 V to 3.6 V over a -40 °C to 105 °C ambient range.

Espressif SystemsComputing Embedded Systems
25 4

ESP32-H2

Low-power wireless SoC integrates a 32-bit RISC-V single-core processor with Bluetooth Low Energy and IEEE 802.15.4 radios. The device supports Thread, Zigbee 3.0, Matter, Bluetooth mesh, and Bluetooth LE long range operation. It includes 128 KB ROM, 320 KB SRAM, 4 KB low-power memory, 16 KB cache, and 2 MB or 4 MB in-package Quad SPI flash. The QFN32 package operates from a 3.0 V to 3.6 V supply over a -40 °C to 105 °C ambient temperature range. Peripheral resources include 19 programmable GPIOs, SPI, UART, I2C, I2S, USB Serial/JTAG, ADC, PWM, RMT, TWAI, and security accelerators.

Espressif SystemsComputing Embedded Systems
25 6

About ESP32-S3-DevKitC-1

The Espressif Systems ESP32-S3-DevKitC-1 Computing Embedded Systems datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: Dual-core microcontroller SoC integrates 2.4 GHz Wi-Fi 4 and Bluetooth LE 5 connectivity for AIoT applications. The device uses an Xtensa LX7 32-bit dual-core CPU running up to 240 MHz with 512 KB SRAM and 384 KB ROM. It provides up to 45 programmable GPIOs plus I2C, I2S, SPI, UART, USB OTG, ADC, touch, SD/MMC host and TWAI interfaces. The QFN56 package operates from 3.0 V to 3.6 V and supports an extended temperature range up to 105 °C for the base ESP32-S3 variant.. Key parameters include ADC: 2 x 12-bit ADC, up to 20 channels, Bluetooth: Bluetooth LE v5.0, Ccats: G194398, CPU Core: Xtensa dual-core 32-bit LX7, and CPU Frequency: 240MHz. ESP32-S3-DevKitC-1 is manufactured by Espressif Systems as part of their Computing Embedded Systems product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer
Espressif Systems
Category
Computing Embedded Systems
File Size
1 MB

Ask AI Assistant

Ask questions about ESP32-S3-DevKitC-1 specifications

AI Powered

Click to ask a quick question:

Parameters

ADC2 x 12-bit ADC, up to 20 channels
BluetoothBluetooth LE v5.0
CcatsG194398
CPU CoreXtensa dual-core 32-bit LX7
CPU Frequency240MHz
ECCN5A992.c
GPIO Count45
Hs Code8542399000
Interfaces2 I2C, 2 I2S, 4 SPI, 3 UART, USB OTG
Operating Temperature-40 to 105°C
PackageQFN56 (7*7)
Pins56
Product TypeSoC
ROM384KB
RTC SRAM16KB
Security FeaturesSecure Boot, Flash Encryption, Digital Signature, HMAC, AES, SHA, RSA, ECC, RNG
SRAM512KB
Supply Voltage3.0 to 3.6V
Wi-Fi Band2.4GHz
Wi-Fi Channel BandwidthHT20/40MHz
Wi-Fi Data RateUp to 150Mbps
Wi-Fi StandardIEEE 802.11b/g/n