ESP8266EX
Highly integrated Wi-Fi 4 SoC provides 802.11 b/g/n connectivity in the 2.4 GHz band with station, SoftAP, and combined station plus SoftAP modes. The device integrates a Tensilica L106 32-bit processor running up to 160 MHz, on-chip SRAM, RF front end functions, power management, and interfaces including UART, SDIO, SPI, I2C, I2S, GPIO, PWM, IR, and ADC. It operates from 2.5 V to 3.6 V across a -40 °C to 125 °C temperature range and is supplied in a 32-pin 5 mm x 5 mm QFN package. The lifecycle status is not recommended for new designs.
Similar Components
ESP32-S2
The 2.4 GHz Wi-Fi MCU module integrates an ESP32-S2 single-core Xtensa 32-bit LX7 processor operating up to 240 MHz. It includes 4 MB SPI flash, 2 MB PSRAM, 37 GPIOs, and an on-board PCB antenna. The module supports IEEE 802.11b/g/n operation from 2412 to 2484 MHz with data rates up to 150 Mbps. It operates from a 3.0 to 3.6 V supply across -40 to 85 °C and is RoHS/REACH green certified. The module measures 18.0 × 31.0 × 3.3 mm and is marked End of Life.
ESP8266
Wi-Fi MCU SoC integrates a 32-bit Tensilica L106 RISC processor with 2.4 GHz IEEE 802.11b/g/n connectivity. The device supports HT20 Wi-Fi data rates up to 75 Mbps and operates from a 2.5 V to 3.6 V supply. It provides 160 KB SRAM, 17 GPIOs, standard digital peripheral interfaces, and on-chip RF and power-management functions. The QFN32 package measures 5 mm by 5 mm and supports industrial operating temperatures from -40 °C to 125 °C.
ESP32-H2
Low-power wireless SoC integrates a 32-bit RISC-V single-core processor with Bluetooth Low Energy and IEEE 802.15.4 radios. The device supports Thread, Zigbee 3.0, Matter, Bluetooth mesh, and Bluetooth LE long range operation. It includes 128 KB ROM, 320 KB SRAM, 4 KB low-power memory, 16 KB cache, and 2 MB or 4 MB in-package Quad SPI flash. The QFN32 package operates from a 3.0 V to 3.6 V supply over a -40 °C to 105 °C ambient temperature range. Peripheral resources include 19 programmable GPIOs, SPI, UART, I2C, I2S, USB Serial/JTAG, ADC, PWM, RMT, TWAI, and security accelerators.
ESP32-S2-WROVER
2.4 GHz Wi-Fi MCU Module with 4 MB Flash
ESP32-S3-DevKitC-1
Dual-core microcontroller SoC integrates 2.4 GHz Wi-Fi 4 and Bluetooth LE 5 connectivity for AIoT applications. The device uses an Xtensa LX7 32-bit dual-core CPU running up to 240 MHz with 512 KB SRAM and 384 KB ROM. It provides up to 45 programmable GPIOs plus I2C, I2S, SPI, UART, USB OTG, ADC, touch, SD/MMC host and TWAI interfaces. The QFN56 package operates from 3.0 V to 3.6 V and supports an extended temperature range up to 105 °C for the base ESP32-S3 variant.
ESP32-C3
Low-power Wi-Fi and Bluetooth Low Energy microcontroller SoC integrates a 32-bit single-core RISC-V processor running up to 160 MHz. The device supports 2.4 GHz IEEE 802.11b/g/n Wi-Fi with 20 MHz and 40 MHz bandwidth and Bluetooth 5 LE data rates from 125 Kbps to 2 Mbps. On-chip resources include 400 KB SRAM, 384 KB ROM, 8 KB RTC SRAM, 4096-bit eFuse memory, security accelerators, and 22 configurable GPIOs. The base chip is supplied in a 32-pin 5 mm by 5 mm QFN package and operates from 3.0 V to 3.6 V over a -40 °C to 105 °C ambient range.
About ESP8266EX
The Espressif Systems ESP8266EX Computing Embedded Systems datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: Highly integrated Wi-Fi 4 SoC provides 802.11 b/g/n connectivity in the 2.4 GHz band with station, SoftAP, and combined station plus SoftAP modes. The device integrates a Tensilica L106 32-bit processor running up to 160 MHz, on-chip SRAM, RF front end functions, power management, and interfaces including UART, SDIO, SPI, I2C, I2S, GPIO, PWM, IR, and ADC. It operates from 2.5 V to 3.6 V across a -40 °C to 125 °C temperature range and is supplied in a 32-pin 5 mm x 5 mm QFN package. The lifecycle status is not recommended for new designs.. Key parameters include ADC input voltage range: 0 to 1.0, ADC resolution: 10, Average operating current: 80, California Proposition 65: Compliant, and Conrad: 4,1541$0.9577——View offer. ESP8266EX is manufactured by Espressif Systems as part of their Computing Embedded Systems product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Espressif Systems
- Category
- Computing Embedded Systems
Ask AI Assistant
Ask questions about ESP8266EX specifications
Click to ask a quick question:
Parameters
| ADC input voltage range | 0 to 1.0 |
| ADC resolution | 10 |
| Average operating current | 80 |
| California Proposition 65 | Compliant |
| Conrad | 4,1541$0.9577——View offer |
| CPU core | Tensilica L106 32-bit processor |
| Deep-sleep current | 20 |
| Encryption | WEP, TKIP, AES |
| Frequency range | 2.4 to 2.5 |
| Frequency range | 2400 to 2483.5 |
| GPIO count | 17 |
| Light-sleep current | 0.9 |
| Maximum CPU clock | 160 |
| Maximum data rate | 72.2 |
| Modem-sleep current | 15 |
| Operating temperature range | -40 to 125 |
| Operating voltage | 2.5 to 3.6 |
| Package | 32-pin QFN |
| Package size | 5 x 5 |
| Peripheral interfaces | UART, SDIO, SPI, I2C, I2S, IR, GPIO, ADC, PWM |
| Pfas | Compliant, including PFOA and PFOS |
| Pops | Compliant with Regulation (EU) 2019/1021 |
| REACH | Compliant with EU REACH (EC 1907/2006), REACH SVHC 250 |
| Receiver sensitivity 802.11b 11 Mbps | -91 |
| Receiver sensitivity 802.11g 54 Mbps | -75 |
| Receiver sensitivity 802.11n MCS7 | -72 |
| RoHS | Compliant with RoHS 2.0 (2015/863/EU) |
| Security | WPA/WPA2 |
| Transmit power 802.11b | +20 |
| Transmit power 802.11g | +17 |
| Transmit power 802.11n | +14 |
| Tsca | Compliant |
| Typical operating voltage | 3.3 |
| Wi-Fi modes | Station, SoftAP, SoftAP+Station |
| Wireless standard | 802.11 b/g/n (HT20) |