XC7Z020-1CLG400C
Field-Programmable Gate Array (FPGA) with 85,000 logic cells and 106,400 registers, built on 28nm process technology. Features 560 Kbit RAM, 220 DSP slices, and 140 Block RAMs. Offers 128 maximum user I/Os, 2 Ethernet MACs, and 4 DLLs/PLLs. Packaged in a 400-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting. Operates within a 0°C to 85°C temperature range.
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About XC7Z020-1CLG400C
The Xilinx XC7Z020-1CLG400C Semiconductors datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: Field-Programmable Gate Array (FPGA) with 85,000 logic cells and 106,400 registers, built on 28nm process technology. Features 560 Kbit RAM, 220 DSP slices, and 140 Block RAMs. Offers 128 maximum user I/Os, 2 Ethernet MACs, and 4 DLLs/PLLs. Packaged in a 400-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting. Operates within a 0°C to 85°C temperature range.. Key parameters include Automotive: Yes, Basic Package Type: Ball Grid Array, Cage Code: 68994, Dedicated DSP: 220, and Device Logic Cells: 85000. XC7Z020-1CLG400C is manufactured by Xilinx as part of their Semiconductors product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Xilinx
- Category
- Semiconductors
- File Size
- 640 KB
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Parameters
| Automotive | Yes |
| Basic Package Type | Ball Grid Array |
| Cage Code | 68994 |
| Dedicated DSP | 220 |
| Device Logic Cells | 85000 |
| Device Number of DLLs/PLLs | 4 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
| ECCN | EAR99 |
| Ethernet MACs | 2 |
| EU RoHS | Yes |
| Family Name | Artix-7 |
| HTS Code | 8542390001 |
| Lead Shape | Ball |
| Maximum Number of User I/Os | 128 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Mounting | Surface Mount |
| Number of Multipliers | 220 (18x25) |
| Number of Registers | 106400 |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.07 |
| Package Length (mm) | 17 |
| Package Material | Plastic |
| Package Width (mm) | 17 |
| PCB | 400 |
| Pin Count | 400 |
| Pin Pitch (mm) | 0.8 |
| Process Technology | 28nm |
| Programmability | Yes |
| Program Memory Type | SRAM |
| RAM Bits | 560Kbit |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Schedule B | 8542390000 |
| Seated Plane Height (mm) | 1.47 |
| Speed Grade | 1 |
| Total Number of Block RAM | 140 |