XC6SLX9-2TQG144C
Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM bits, 32 block RAMs, and 16 dedicated DSP multipliers (18x18). Offers 102 user I/Os and supports transceiver speeds up to 3.2 Gbps. Packaged in a 144-pin TQFP EP (Thin Quad Flat Package, Exposed Pad) with gull-wing leads, measuring 20x20mm with a 0.5mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C and includes 6 DLLs/PLLs.
Similar Components
XC7Z020-1CLG400C
Field-Programmable Gate Array (FPGA) with 85,000 logic cells and 106,400 registers, built on 28nm process technology. Features 560 Kbit RAM, 220 DSP slices, and 140 Block RAMs. Offers 128 maximum user I/Os, 2 Ethernet MACs, and 4 DLLs/PLLs. Packaged in a 400-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting. Operates within a 0°C to 85°C temperature range.
XC7Z010-1CLG400C
Field Programmable Gate Array (FPGA) with 28,000 logic cells and 35,200 registers, built on 28nm process technology. Features 240 Kbit RAM, 80 multipliers (18x25), and 60 Block RAMs. Includes 2 Ethernet MACs and 80 dedicated DSP slices. Offers 128 maximum user I/Os and supports differential I/O standards like LVDS, SSTL, and HSTL. Packaged in a 400-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
XC7A100T-1FGG484C
High-performance Field Programmable Gate Array (FPGA) featuring 7925 Configurable Logic Blocks (CLBs) and 101,440 logic cells. Operates at a maximum clock frequency of 1098 MHz, with a supply voltage range of 0.95V to 1.05V. This CMOS device is housed in a 484-terminal PBGA package (23mm x 23mm) with bottom terminal positioning. Designed for operation between 0°C and 85°C, it offers 285 inputs and 285 outputs.
XC7A35T-1FTG256C
Field-Programmable Gate Array (FPGA) with 33,280 logic cells and 28nm technology. Features a maximum clock frequency of 1098 MHz, 250 inputs, and 250 outputs. Operates within a temperature range of 0°C to 85°C with a nominal supply voltage of 1V (0.95V to 1.05V). Packaged in a 256-pin, 17mm x 17mm FTBGA (S-PBGA-B256) with bottom terminal position.
About XC6SLX9-2TQG144C
The Xilinx XC6SLX9-2TQG144C Semiconductors datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM bits, 32 block RAMs, and 16 dedicated DSP multipliers (18x18). Offers 102 user I/Os and supports transceiver speeds up to 3.2 Gbps. Packaged in a 144-pin TQFP EP (Thin Quad Flat Package, Exposed Pad) with gull-wing leads, measuring 20x20mm with a 0.5mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C and includes 6 DLLs/PLLs.. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Lead-Frame SMT, Cage Code: 68994, and Dedicated DSP: 16. XC6SLX9-2TQG144C is manufactured by Xilinx as part of their Semiconductors product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Xilinx
- Category
- Semiconductors
- File Size
- 319 KB
Ask AI Assistant
Ask questions about XC6SLX9-2TQG144C specifications
Click to ask a quick question:
Parameters
| AEC Qualified | No |
| Automotive | No |
| Basic Package Type | Lead-Frame SMT |
| Cage Code | 68994 |
| Dedicated DSP | 16 |
| Device Logic Cells | 9152 |
| Device Number of DLLs/PLLs | 6 |
| ECCN | EAR99 |
| EU RoHS | Yes |
| External Memory Interface | DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM |
| Family Name | Spartan®-6 LX |
| HTS Code | 8542390001 |
| Jedec | MS-026BFB |
| Lead Shape | Gull-wing |
| Maximum Number of User I/Os | 102 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Mounting | Surface Mount |
| Number of Multipliers | 16 (18x18) |
| Number of Registers | 11440 |
| Package/Case | TQFP EP |
| Package Description | Thin Quad Flat Package, Exposed Pad |
| Package Family Name | QFP |
| Package Height (mm) | 1.4 |
| Package Length (mm) | 20 |
| Package Material | Plastic |
| Package Orientation | Yes |
| Package Orientation Marking Type | Dot |
| Package Width (mm) | 20 |
| PCB | 144 |
| Pin Count | 144 |
| Pin Pitch (mm) | 0.5 |
| PPAP | No |
| Process Technology | 45nm |
| Programmability | Yes |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| RAM Bits | 576Kbit |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Schedule B | 8542390000 |
| Seated Plane Height (mm) | 1.6(Max) |
| Speed Grade | 2 |
| Total Number of Block RAM | 32 |
| Transceiver Speed | 3.2Gbps |