The Microchip W3EG6432S335D4 Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DDR SDRAM 256MB 333MHz 200-pin USODIMM Module. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 2.5. W3EG6432S335D4 is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: Microchip
Category: Data Storage
File Size: 185 KB

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Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Non-Lead-Frame SMT
Cage Code	60991
CAS Latency	2.5
Chip Configuration	32Mx8
Chip Density	256M
Chip Package Type	TSOP
Data Bus Width	64
ECCN	EAR99
ECC Support	No
EU RoHS	No
HTS Code	8473301140
Lead Shape	No Lead
Main Category	DRAM Module
Maximum Access Time	0.7
Maximum Clock Rate	333
Maximum Operating Current	3280
Max Operating Supply Voltage	2.7
Max Operating Temperature	70
Min Operating Supply Voltage	2.3
Min Operating Temperature	0
Module Type	200SODIMM
Mounting	Socket
Number of Chip per Module	8
Organization	32Mx64
Package/Case	USODIMM
Package Description	Unbuffered Small Outline Dual In Line Memory Module
Package Family Name	DIM
Package Height (mm)	31.75
Package Length (mm)	67.56(Max)
Package Width (mm)	3.81(Max)
PCB	200
Pin Count	200
PPAP	No
RoHS Versions	2011/65/EU, 2015/863
Schedule B	8473300002
Subcategory	DDR SDRAM
Total Density	256Mbyte
Typical Operating Supply Voltage	2.5