W3EG6432S265D4I

DRAM Module 256MB DDR2 200SODIMM 266MHz 64-bit

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About W3EG6432S265D4I

The Microchip W3EG6432S265D4I Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DRAM Module 256MB DDR2 200SODIMM 266MHz 64-bit. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 2.5. W3EG6432S265D4I is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer
Microchip
Category
Data Storage
File Size
185 KB

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Parameters

AEC QualifiedNo
AutomotiveNo
Basic Package TypeNon-Lead-Frame SMT
Cage Code60991
CAS Latency2.5
Chip Configuration32Mx8
Chip Density256M
Chip Package TypeTSOP
Data Bus Width64
ECCN4A994.a
ECC SupportNo
EU RoHSNo
HTS Code8473301140
Lead ShapeNo Lead
Main CategoryDRAM Module
Maximum Access Time0.75
Maximum Clock Rate266
Maximum Operating Current2800
Max Operating Supply Voltage2.7
Max Operating Temperature85
Min Operating Supply Voltage2.3
Min Operating Temperature-40
Module Type200SODIMM
MountingSocket
Number of Chip per Module8
Organization32Mx64
Package/CaseUSODIMM
Package DescriptionUnbuffered Small Outline Dual In Line Memory Module
Package Family NameDIM
Package Height (mm)31.75
Package Length (mm)67.56(Max)
Package Width (mm)3.81(Max)
PCB200
Pin Count200
PPAPNo
RoHS Versions2011/65/EU, 2015/863
Schedule B8473300002
SubcategoryDDR SDRAM
Total Density256Mbyte
Typical Operating Supply Voltage2.5