WED3DG638V75D2I
DRAM Module 64MB SDRAM 133MHz 168-Pin UDIMM 3.3V
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About WED3DG638V75D2I
The Microchip WED3DG638V75D2I Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DRAM Module 64MB SDRAM 133MHz 168-Pin UDIMM 3.3V. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 3. WED3DG638V75D2I is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Microchip
- Category
- Data Storage
- File Size
- 100 KB
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Parameters
| AEC Qualified | No |
| Automotive | No |
| Basic Package Type | Non-Lead-Frame SMT |
| Cage Code | 60991 |
| CAS Latency | 3 |
| Chip Configuration | 4Mx16 |
| Chip Density | 64M |
| Chip Package Type | TSOP |
| Data Bus Width | 64 |
| ECCN | 4A994.a |
| ECC Support | No |
| HTS Code | 8473301140 |
| Lead Shape | No Lead |
| Main Category | DRAM Module |
| Maximum Clock Rate | 133 |
| Maximum Operating Current | 650 |
| Max Operating Supply Voltage | 3.6 |
| Max Operating Temperature | 85 |
| Min Operating Supply Voltage | 3 |
| Min Operating Temperature | -40 |
| Module Type | 168DIMM |
| Mounting | Socket |
| Number of Chip per Module | 8 |
| Organization | 8Mx64 |
| Package/Case | UDIMM |
| Package Description | Unbuffered Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 25.4 |
| Package Length (mm) | 133.48(Max) |
| Package Width (mm) | 3.81(Max) |
| PCB | 168 |
| Pin Count | 168 |
| PPAP | No |
| Schedule B | 8473300002 |
| Subcategory | SDRAM |
| Total Density | 64Mbyte |
| Typical Operating Supply Voltage | 3.3 |