The Microchip W3EG6464S263JD3 Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DDR SDRAM 512MB 266MHz 184-Pin UDIMM Module. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 2. W3EG6464S263JD3 is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: Microchip
Category: Data Storage
File Size: 246 KB

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Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Non-Lead-Frame SMT
Cage Code	60991
CAS Latency	2
Chip Configuration	64Mx8
Chip Density	512M
Chip Package Type	TSOP
Data Bus Width	64
ECCN	EAR99
ECC Support	No
EU RoHS	No
HTS Code	8473301140
Lead Shape	No Lead
Main Category	DRAM Module
Maximum Access Time	0.75
Maximum Clock Rate	266
Maximum Operating Current	3840
Max Operating Supply Voltage	2.7
Max Operating Temperature	70
Min Operating Supply Voltage	2.3
Min Operating Temperature	0
Module Type	184DIMM
Mounting	Socket
Number of Chip per Module	8
Organization	64Mx64
Package/Case	UDIMM
Package Description	Unbuffered Dual In Line Memory Module
Package Family Name	DIM
Package Height (mm)	30.48(Max)
Package Length (mm)	133.48(Max)
Package Width (mm)	2.54(Max)
PCB	184
Pin Count	184
Pin Pitch (mm)	1.27
PPAP	No
RoHS Versions	2011/65/EU, 2015/863
Schedule B	8473300002
Subcategory	DDR SDRAM
Total Density	512Mbyte
Typical Operating Supply Voltage	2.5