WV3EG232M64STSU403D4SG
512Mbyte DDR SDRAM DRAM Module, 200-pin USODIMM, operating at 400 MHz with a 64-bit data bus width. Features 8 x 512Mbit TSOP chips, organized as 32Mx64x2, with a CAS Latency of 3 and a maximum access time of 0.65 ns. This unbuffered small outline dual in-line memory module supports dual ranks and operates from a 2.3V to 2.7V supply, with a typical voltage of 2.5V. Designed for socket mounting, it has a non-lead-frame SMT basic package type and a maximum package length of 67.75mm.
Similar Components
MCP3201-CI/SN
12-Bit 1-Ch SAR ADC, 100kS/s, SPI, SOIC, Single-Ended
24LC02B-I/SN
2Kb Serial EEPROM memory, organized as 256 x 8, features an I2C interface operating up to 400kHz. This non-volatile memory component offers a fast 900ns access time and supports supply voltages from 2.5V to 5.5V. Packaged in a lead-free, matte tin-plated SOIC with dimensions of 4.9mm (L) x 3.9mm (W) x 1.25mm (H), it is designed for surface mounting. Operating within a temperature range of -40°C to 85°C, this RoHS compliant EEPROM includes write protection.
MCP3424-E/SL
18-bit, 4-channel delta-sigma Analog-to-Digital Converter (ADC) with a serial interface. Features a maximum analog input voltage of 2.048V and a minimum of -2.048V. Operates within an automotive temperature grade from -40°C to 125°C. Housed in a 14-pin SOIC package with dual terminal positions, measuring 3.9mm in width and 8.65mm in length.
TC4420EPA
Automotive-grade, single-output gate driver IC designed for low-side, non-inverting applications. Delivers a maximum output current of 6A with a typical propagation delay of 75ns and fall time of 35ns. Operates from a 4.5V to 18V supply voltage range, featuring a low input bias current of 10µA and a maximum supply current of 1.5mA. Packaged in an 8-pin PDIP for through-hole mounting, this RoHS-compliant component has a maximum power dissipation of 730mW and an operating temperature range of -40°C to 85°C.
24LC512-I/SN
512Kb Serial EEPROM, 64K x 8 organization, featuring I2C interface with a maximum frequency of 400kHz. This non-volatile memory component offers a wide operating voltage range of 2.5V to 5.5V and a fast access time of 900ns. Packaged in an 8-pin SOIC, it supports write protection and is RoHS compliant.
MCP23017
A 16-bit general-purpose I/O expander provides two 8-bit ports controlled over an I2C-compatible serial interface. The device operates from a 1.8 V to 5.5 V supply and supports standard, fast, and high-speed I2C bus rates. Three hardware address pins allow up to eight devices on the same bus, and the GPIO pins include polarity inversion and interrupt-on-change functions. The device is specified for industrial operation from -40 °C to +85 °C and is available in multiple 28-lead package options.
About WV3EG232M64STSU403D4SG
The Microchip WV3EG232M64STSU403D4SG Semiconductors datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: 512Mbyte DDR SDRAM DRAM Module, 200-pin USODIMM, operating at 400 MHz with a 64-bit data bus width. Features 8 x 512Mbit TSOP chips, organized as 32Mx64x2, with a CAS Latency of 3 and a maximum access time of 0.65 ns. This unbuffered small outline dual in-line memory module supports dual ranks and operates from a 2.3V to 2.7V supply, with a typical voltage of 2.5V. Designed for socket mounting, it has a non-lead-frame SMT basic package type and a maximum package length of 67.75mm.. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 3. WV3EG232M64STSU403D4SG is manufactured by Microchip as part of their Semiconductors product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Microchip
- Category
- Semiconductors
- File Size
- 194 KB
Ask AI Assistant
Ask questions about WV3EG232M64STSU403D4SG specifications
Click to ask a quick question:
Parameters
| AEC Qualified | No |
| Automotive | No |
| Basic Package Type | Non-Lead-Frame SMT |
| Cage Code | 60991 |
| CAS Latency | 3 |
| Chip Configuration | 32Mx16 |
| Chip Density | 512Mbit |
| Chip Package Type | TSOP |
| Data Bus Width | 64bit |
| ECCN | EAR99 |
| ECC Support | No |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Lead Shape | No Lead |
| Main Category | DRAM Module |
| Maximum Access Time | 0.65ns |
| Maximum Clock Rate | 400MHz |
| Maximum Operating Current | 1620mA |
| Max Operating Supply Voltage | 2.7V |
| Max Operating Temperature | 70°C |
| Min Operating Supply Voltage | 2.3V |
| Min Operating Temperature | 0°C |
| Module Type | 200SODIMM |
| Mounting | Socket |
| Number of Chip per Module | 8 |
| Number of Ranks | Dual |
| Organization | 32Mx64x2 |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 31.9(Max) |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 3.8(Max) |
| PCB | 200 |
| Pin Count | 200 |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
| Schedule B | 8473300002 |
| Subcategory | DDR SDRAM |
| Total Density | 512Mbyte |
| Typical Operating Supply Voltage | 2.5V |