WV3EG232M64STSU335D4ISG
DRAM Module 512MB DDR2 333MHz 200SODIMM 32Mx64
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About WV3EG232M64STSU335D4ISG
The Microchip WV3EG232M64STSU335D4ISG Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DRAM Module 512MB DDR2 333MHz 200SODIMM 32Mx64. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 2.5. WV3EG232M64STSU335D4ISG is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Microchip
- Category
- Data Storage
- File Size
- 194 KB
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Parameters
| AEC Qualified | No |
| Automotive | No |
| Basic Package Type | Non-Lead-Frame SMT |
| Cage Code | 60991 |
| CAS Latency | 2.5 |
| Chip Configuration | 32Mx16 |
| Chip Density | 512M |
| Chip Package Type | TSOP |
| Data Bus Width | 64 |
| ECCN | 4A994.a |
| ECC Support | No |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Lead Shape | No Lead |
| Main Category | DRAM Module |
| Maximum Access Time | 0.7 |
| Maximum Clock Rate | 333 |
| Maximum Operating Current | 3040 |
| Max Operating Supply Voltage | 2.7 |
| Max Operating Temperature | 85 |
| Min Operating Supply Voltage | 2.3 |
| Min Operating Temperature | -40 |
| Module Type | 200SODIMM |
| Mounting | Socket |
| Number of Chip per Module | 8 |
| Number of Ranks | Dual |
| Organization | 32Mx64x2 |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 31.9(Max) |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 3.8(Max) |
| PCB | 200 |
| Pin Count | 200 |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
| Schedule B | 8473300002 |
| Subcategory | DDR SDRAM |
| Total Density | 512Mbyte |
| Typical Operating Supply Voltage | 2.5 |