The Microchip WED3DG638V10D2I Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DRAM Module 64MB SDRAM 100MHz 168-DIMM 3.3V. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 2. WED3DG638V10D2I is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: Microchip
Category: Data Storage
File Size: 100 KB

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Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Non-Lead-Frame SMT
Cage Code	60991
CAS Latency	2
Chip Configuration	4Mx16
Chip Density	64M
Chip Package Type	TSOP
Data Bus Width	64
ECCN	4A994.a
ECC Support	No
HTS Code	8473301140
Lead Shape	No Lead
Main Category	DRAM Module
Maximum Clock Rate	100
Maximum Operating Current	540
Max Operating Supply Voltage	3.6
Max Operating Temperature	85
Min Operating Supply Voltage	3
Min Operating Temperature	-40
Module Type	168DIMM
Mounting	Socket
Number of Chip per Module	8
Organization	8Mx64
Package/Case	UDIMM
Package Description	Unbuffered Dual In Line Memory Module
Package Family Name	DIM
Package Height (mm)	25.4
Package Length (mm)	133.48(Max)
Package Width (mm)	3.81(Max)
PCB	168
Pin Count	168
PPAP	No
Schedule B	8473300002
Subcategory	SDRAM
Total Density	64Mbyte
Typical Operating Supply Voltage	3.3