W3DG6335V75D2

256MB SDRAM 133MHz 168-Pin UDIMM Module

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About W3DG6335V75D2

The Microchip W3DG6335V75D2 Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: 256MB SDRAM 133MHz 168-Pin UDIMM Module. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 3. W3DG6335V75D2 is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer
Microchip
Category
Data Storage
File Size
141 KB

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Parameters

AEC QualifiedNo
AutomotiveNo
Basic Package TypeNon-Lead-Frame SMT
Cage Code60991
CAS Latency3
Chip Configuration32Mx8
Chip Density256M
Chip Package TypeTSOP
Data Bus Width64
ECCNEAR99
ECC SupportNo
EU RoHSNo
HTS Code8473301140
Lead ShapeNo Lead
Main CategoryDRAM Module
Maximum Clock Rate133
Maximum Operating Current880
Max Operating Supply Voltage3.6
Max Operating Temperature70
Min Operating Supply Voltage3
Min Operating Temperature0
Module Type168DIMM
MountingSocket
Number of Chip per Module8
Organization32Mx64
Package/CaseUDIMM
Package DescriptionUnbuffered Dual In Line Memory Module
Package Family NameDIM
Package Height (mm)30.48(Max)
Package Length (mm)133.48(Max)
Package Width (mm)2.54(Max)
PCB168
Pin Count168
PPAPNo
RoHS Versions2011/65/EU, 2015/863
Schedule B8473300002
SubcategorySDRAM
Total Density256Mbyte
Typical Operating Supply Voltage3.3