The Microchip W3DG6335V10D2 Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: 256MB SDRAM 100MHz 3.3V 168-Pin UDIMM Module. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 2. W3DG6335V10D2 is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: Microchip
Category: Data Storage
File Size: 141 KB

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Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Non-Lead-Frame SMT
Cage Code	60991
CAS Latency	2
Chip Configuration	32Mx8
Chip Density	256M
Chip Package Type	TSOP
Data Bus Width	64
ECCN	EAR99
ECC Support	No
EU RoHS	No
HTS Code	8473301140
Lead Shape	No Lead
Main Category	DRAM Module
Maximum Clock Rate	100
Maximum Operating Current	880
Max Operating Supply Voltage	3.6
Max Operating Temperature	70
Min Operating Supply Voltage	3
Min Operating Temperature	0
Module Type	168DIMM
Mounting	Socket
Number of Chip per Module	8
Organization	32Mx64
Package/Case	UDIMM
Package Description	Unbuffered Dual In Line Memory Module
Package Family Name	DIM
Package Height (mm)	30.48(Max)
Package Length (mm)	133.48(Max)
Package Width (mm)	2.54(Max)
PCB	168
Pin Count	168
PPAP	No
RoHS Versions	2011/65/EU, 2015/863
Schedule B	8473300002
Subcategory	SDRAM
Total Density	256Mbyte
Typical Operating Supply Voltage	3.3