HMT325S6BFR6C-H9
DDR3 2GB 1333MHz 204-Pin USODIMM RAM Module
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About HMT325S6BFR6C-H9
The SK Hynix HMT325S6BFR6C-H9 Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DDR3 2GB 1333MHz 204-Pin USODIMM RAM Module. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 9162F, and CAS Latency: 9. HMT325S6BFR6C-H9 is manufactured by SK Hynix as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- SK Hynix
- Category
- Data Storage
- File Size
- 464 KB
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Parameters
| AEC Qualified | No |
| Automotive | No |
| Basic Package Type | Non-Lead-Frame SMT |
| Cage Code | 9162F |
| CAS Latency | 9 |
| Chip Configuration | 128Mx16 |
| Chip Density | 2G |
| Data Bus Width | 64 |
| ECCN | EAR99 |
| ECC Support | No |
| EU RoHS | Yes |
| HTS Code | 8473301140 |
| Lead Shape | No Lead |
| Main Category | DRAM Module |
| Maximum Clock Rate | 1333 |
| Max Operating Supply Voltage | 1.575 |
| Max Operating Temperature | 85 |
| Min Operating Supply Voltage | 1.425 |
| Min Operating Temperature | 0 |
| Module Type | 240SODIMM |
| Mounting | Socket |
| Number of Chip per Module | 8 |
| Number of Ranks | Dual |
| Organization | 256Mx64 |
| Package/Case | USODIMM |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 30 |
| Package Length (mm) | 67.6 |
| Package Width (mm) | 3.8(Max) |
| PCB | 204 |
| Pin Count | 204 |
| Pin Pitch (mm) | 0.6 |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
| Schedule B | 8473300002 |
| Subcategory | DDR3 SDRAM |
| Total Density | 2Gbyte |
| Typical Operating Supply Voltage | 1.5 |