The SK Hynix HMT325U6BFR8C-PB Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DDR3 SDRAM 2GB 1600MHz 240-Pin UDIMM 1.5V. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 9162F, and CAS Latency: 11. HMT325U6BFR8C-PB is manufactured by SK Hynix as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: SK Hynix
Category: Data Storage
File Size: 596 KB

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Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Non-Lead-Frame SMT
Cage Code	9162F
CAS Latency	11
Chip Configuration	256Mx8
Chip Density	2G
Data Bus Width	64
ECCN	EAR99
ECC Support	No
EU RoHS	Yes
HTS Code	8473301140
Lead Shape	No Lead
Main Category	DRAM Module
Maximum Access Time	20
Maximum Clock Rate	1600
Maximum Operating Current	880
Max Operating Supply Voltage	1.575
Max Operating Temperature	85
Min Operating Supply Voltage	1.425
Min Operating Temperature	0
Module Type	240UDIMM
Mounting	Socket
Number of Chip per Module	8
Number of Ranks	Single
Organization	256Mx64
Package/Case	UDIMM
Package Description	Unbuffered Dual In Line Memory Module
Package Family Name	DIM
Package Height (mm)	30
Package Length (mm)	133.35
Package Width (mm)	3.18(Max)
PCB	240
Pin Count	240
Pin Pitch (mm)	1
PPAP	No
Radiation Hardening	No
RoHS Versions	2002/95/EC
Schedule B	8473300002
Subcategory	DDR3 SDRAM
Total Density	2Gbyte
Typical Operating Supply Voltage	1.5