AS8FLC1M32BQ-120/IT
32Mbit Parallel Flash Module, 120ns, 32-bit, 3.3V, CQFP
Similar Components
AS8FLC1M32BQ-120/XT
32Mbit Parallel Flash Module, 120ns, 32-bit, Ceramic CQFP, 68-Pin, 3.3V
AS8FLC1M32BQ-70/Q
32Mbit Parallel Flash Module, 70ns, 1Mx32, 3.3V, Ceramic CQFP
AS8FLC1M32BP-90/XT
32Mbit Flash Module, 1Mx32 Organization, 3.3V, 140mA, -55C to 125C, HIP Package
AS8FLC1M32BQ-100/Q
32Mbit Parallel Flash Module, 100ns, 32-bit, 3.3V, Ceramic CQFP
AS8FLC1M32BQ-70/XT
32Mbit Parallel Flash Module, 70ns, 1Mx32, 3.3V, CQFP
AS8FLC1M32BQ-90/Q
32Mbit Parallel Flash Module, 90ns, 32-bit, Ceramic CQFP, 3.3V
About AS8FLC1M32BQ-120/IT
The Micross AS8FLC1M32BQ-120/IT Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: 32Mbit Parallel Flash Module, 120ns, 32-bit, 3.3V, CQFP. Key parameters include Basic Package Type: Lead-Frame SMT, Cage Code: 0LRZ0, Chip Configuration: 1Mx8, Chip Density: 8M, and Chip Package Type: CQFP. AS8FLC1M32BQ-120/IT is manufactured by Micross as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Micross
- Category
- Data Storage
- File Size
- 279 KB
Ask AI Assistant
Ask questions about AS8FLC1M32BQ-120/IT specifications
Click to ask a quick question:
Parameters
| Basic Package Type | Lead-Frame SMT |
| Cage Code | 0LRZ0 |
| Chip Configuration | 1Mx8 |
| Chip Density | 8M |
| Chip Package Type | CQFP |
| Data Bus Width | 32 |
| ECCN | 4A994.a |
| ECC Support | No |
| HTS Code | 8473301140 |
| Main Category | Flash Module |
| Maximum Access Time | 120 |
| Maximum Operating Current | 140 |
| Max Operating Temperature | 85 |
| Min Operating Temperature | -40 |
| Mounting | Surface Mount |
| Number of Chip per Module | 4 |
| Organization | 1Mx32 |
| Package/Case | CQFP |
| Package Description | Ceramic Quad Flat Package |
| Package Family Name | QFP |
| Package Height (mm) | 3.18(Max) |
| Package Length (mm) | 22.61(Max) |
| Package Material | Ceramic |
| Package Width (mm) | 22.61(Max) |
| PCB | 68 |
| Pin Count | 68 |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
| Schedule B | 8473300002 |
| Seated Plane Height (mm) | 3.56(Max) |
| Subcategory | Parallel |
| Total Density | 32Mbit |
| Typical Operating Supply Voltage | 3.3 |