AS8FLC1M32BP-70/IT
64Mbit Flash Module, 1Mx32 Organization, 3.3V, 140mA, -40 to 85°C, HIP Package
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About AS8FLC1M32BP-70/IT
The Micross AS8FLC1M32BP-70/IT Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: 64Mbit Flash Module, 1Mx32 Organization, 3.3V, 140mA, -40 to 85°C, HIP Package. Key parameters include AEC Qualified: No, Automotive: No, Cage Code: 0LRZ0, Chip Configuration: 1Mx8, and Chip Density: 8M. AS8FLC1M32BP-70/IT is manufactured by Micross as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Micross
- Category
- Data Storage
- File Size
- 341 KB
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Parameters
| AEC Qualified | No |
| Automotive | No |
| Cage Code | 0LRZ0 |
| Chip Configuration | 1Mx8 |
| Chip Density | 8M |
| Chip Package Type | HIP |
| Data Bus Width | 32 |
| ECCN | 4A994.a |
| ECC Support | No |
| HTS Code | 8473301140 |
| Main Category | Flash Module |
| Maximum Access Time | 70 |
| Maximum Operating Current | 140 |
| Max Operating Temperature | 85 |
| Min Operating Temperature | -40 |
| Mounting | Through Hole |
| Number of Chip per Module | 4 |
| Organization | 1Mx32 |
| Package/Case | HIP |
| Package Height (mm) | 5.33(Max) |
| Package Length (mm) | 30.48(Max) |
| Package Width (mm) | 30.48(Max) |
| PCB | 66 |
| Pin Count | 66 |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
| Schedule B | 8473300002 |
| Seated Plane Height (mm) | 6.22(Max) |
| Subcategory | Parallel |
| Total Density | 32Mbit |
| Typical Operating Supply Voltage | 3.3 |