W3DG648V75D2

DRAM Module 64MB SDRAM 133MHz 168-DIMM 3.3V

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About W3DG648V75D2

The Microchip W3DG648V75D2 Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DRAM Module 64MB SDRAM 133MHz 168-DIMM 3.3V. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 60991, and CAS Latency: 3. W3DG648V75D2 is manufactured by Microchip as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer
Microchip
Category
Data Storage
File Size
100 KB

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Parameters

AEC QualifiedNo
AutomotiveNo
Basic Package TypeNon-Lead-Frame SMT
Cage Code60991
CAS Latency3
Chip Configuration4Mx16
Chip Density64M
Chip Package TypeTSOP
Data Bus Width64
ECCNEAR99
ECC SupportNo
HTS Code8473301140
Lead ShapeNo Lead
Main CategoryDRAM Module
Maximum Clock Rate133
Maximum Operating Current650
Max Operating Supply Voltage3.6
Max Operating Temperature70
Min Operating Supply Voltage3
Min Operating Temperature0
Module Type168DIMM
MountingSocket
Number of Chip per Module8
Organization8Mx64
Package/CaseUDIMM
Package DescriptionUnbuffered Dual In Line Memory Module
Package Family NameDIM
Package Height (mm)25.4
Package Length (mm)133.48(Max)
Package Width (mm)3.81(Max)
PCB168
Pin Count168
PPAPNo
Schedule B8473300002
SubcategorySDRAM
Total Density64Mbyte
Typical Operating Supply Voltage3.3