MBD-X9DRW-3LN4F+ -B
XEON BOARDS WITH BULK PACK
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About MBD-X9DRW-3LN4F+ -B
The Super Micro Computer MBD-X9DRW-3LN4F+ -B Embedded Computers datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: XEON BOARDS WITH BULK PACK. Key parameters include BIOS: AMI 128Mb, Cage Code: 3VMS9, Chipset Type: Intel C606, Ethernet Card Number of Connectors: 4, and Ethernet Controller Type: Intel I350. MBD-X9DRW-3LN4F+ -B is manufactured by Super Micro Computer as part of their Embedded Computers product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.
Specifications
- Manufacturer
- Super Micro Computer
- Category
- Embedded Computers
- File Size
- 315 KB
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Parameters
| BIOS | AMI 128Mb |
| Cage Code | 3VMS9 |
| Chipset Type | Intel C606 |
| Ethernet Card Number of Connectors | 4 |
| Ethernet Controller Type | Intel I350 |
| EU RoHS | Yes |
| HTS Code | 8471500150 |
| Number of System Memory | 24 |
| On Board Ethernet Card | Yes |
| On Board Graphic Card | No |
| RoHS Versions | 2002/95/EC |
| Schedule B | 8471500150 |
| System Memory Number of Socket Pins | 240 |
| System Memory Socket Type | DIMM |
| System Memory Speed | 800M|1066M|1333M|1600M|1866M |
| System Memory Type | DDR3 |
| USB | 7 |