The Samsung M470L2923DV0-CB300 Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DRAM Module 1GB DDR2 200USODIMM 64-bit 333MHz. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 1542F, and CAS Latency: 2.5. M470L2923DV0-CB300 is manufactured by Samsung as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: Samsung
Category: Data Storage
File Size: 265 KB

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Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Non-Lead-Frame SMT
Cage Code	1542F
CAS Latency	2.5
Chip Configuration	64Mx8
Chip Density	512M
Chip Package Type	66TSOP-II
Data Bus Width	64
ECCN	EAR99
ECC Support	No
EU RoHS	Yes
HTS Code	8473301140
Lead Shape	No Lead
Main Category	DRAM Module
Maximum Access Time	0.7
Maximum Clock Rate	333
Maximum Operating Current	1560
Max Operating Supply Voltage	2.7
Max Operating Temperature	70
Min Operating Supply Voltage	2.3
Min Operating Temperature	0
Module Type	200USODIMM
Mounting	Socket
Number of Chip per Module	16
Number of Ranks	Dual
Organization	128Mx64
Package/Case	USODIMM
Package Description	Unbuffered Small Outline Dual In Line Memory Module
Package Family Name	DIM
Package Height (mm)	31.75
Package Length (mm)	67.6
Package Width (mm)	3.8(Max)
PCB	200
Pin Count	200
Pin Pitch (mm)	0.6
PPAP	No
RoHS Versions	2002/95/EC
Schedule B	8473300002
Subcategory	DDR SDRAM
Total Density	1Gbyte
Typical Operating Supply Voltage	2.5