The Kingston KHX1600C10D3B1/8G Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: DDR3 SDRAM 8GB 1600MHz 240-Pin DIMM CL10. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Non-Lead-Frame SMT, Cage Code: 0P2J5, and CAS Latency: 10. KHX1600C10D3B1/8G is manufactured by Kingston as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: Kingston
Category: Data Storage
File Size: 181 KB

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Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Non-Lead-Frame SMT
Cage Code	0P2J5
CAS Latency	10
Chip Configuration	512Mx8
Chip Density	4G
Chip Package Type	FBGA
Data Bus Width	64
ECCN	EAR99
ECC Support	No
HTS Code	8473301140
Lead Shape	No Lead
Main Category	DRAM Module
Maximum Clock Rate	1600
Max Operating Supply Voltage	1.575
Max Operating Temperature	85
Min Operating Supply Voltage	1.425
Min Operating Temperature	0
Module Type	240DIMM
Mounting	Socket
Number of Chip per Module	16
Number of Ranks	Dual
Organization	1Gx64
Package/Case	DIMM
Package Description	Dual In Line Memory Module
Package Family Name	DIM
Package Height (mm)	30
Package Length (mm)	133.35
PCB	240
Pin Count	240
Pin Pitch (mm)	1
PPAP	No
RoHS Versions	2002/95/EC
Schedule B	8473300002
Subcategory	DDR3 SDRAM
Total Density	8Gbyte
Typical Operating Supply Voltage	1.5