The SK Hynix H5GQ1H24AFR-T3C Data Storage datasheet provides detailed technical specifications, pinout information, and operating characteristics. This component: GDDR5 SGRAM 1Gbit DRAM Module, 170-Pin BGA, 2750MHz. Key parameters include AEC Qualified: No, Automotive: No, Basic Package Type: Ball Grid Array, Cage Code: 9162F, and Chip Density: 64M. H5GQ1H24AFR-T3C is manufactured by SK Hynix as part of their Data Storage product line. On this page you can view and download the PDF datasheet, check specifications, and find similar components.

Specifications

Manufacturer: SK Hynix
Category: Data Storage
File Size: 3 MB

Ask AI Assistant

Ask questions about H5GQ1H24AFR-T3C specifications

AI Powered

Click to ask a quick question:

Parameters

AEC Qualified	No
Automotive	No
Basic Package Type	Ball Grid Array
Cage Code	9162F
Chip Density	64M
Chip Package Type	BGA
Data Bus Width	32
ECCN	EAR99
ECC Support	No
EU RoHS	Yes
HTS Code	8473301140
Lead Shape	Ball
Main Category	DRAM Module
Maximum Access Time	6
Maximum Clock Rate	2750
Maximum Operating Current	1760
Max Operating Supply Voltage	1.545
Min Operating Supply Voltage	1.455
Module Type	PGA Module
Mounting	Surface Mount
Number of Chip per Module	16
Organization	32Mx32
Package/Case	BGA
Package Description	Plastic Ball Grid Array
Package Family Name	BGA
Package Height (mm)	0.75
Package Length (mm)	14
Package Material	Plastic
Package Width (mm)	12
PCB	170
Pin Count	170
Pin Pitch (mm)	0.8
PPAP	No
Radiation Hardening	No
RoHS Versions	2002/95/EC
Schedule B	8473300002
Seated Plane Height (mm)	1.1
Subcategory	GDDR5 SGRAM
Total Density	1Gbit
Typical Operating Supply Voltage	1.5